Manufacturing

Capabilities engineered for every program.

From quick-turn 2-layer prototypes to mil-spec 32-layer rigid-flex — we cover it.

Technology stack

Specifications represent maximum capability across our US and qualified partner facilities.

Layer count

1 – 32 layers

Min trace / space

2 mil / 2 mil

Min hole size

4 mil mechanical, 3 mil laser

Max board size

24" × 36"

Material

FR-4, High-Tg, Polyimide, Rogers, Isola

Copper weight

½ oz – 6 oz

Surface finish

ENIG, HASL, LF-HASL, Immersion Silver/Tin, OSP, Hard Gold

Solder mask

Green, black, blue, red, white, matte

Impedance control

±5% / ±10%

Standards

IPC-A-600 Class 2 / 3 / 3A

Board types

Standard Rigid

FR-4, 2–16 layers, the workhorse of electronics manufacturing.

HDI / Anylayer (ELIC)

Microvias, sequential lamination, every-layer-interconnect for compact designs.

Flex

Single, double, and multilayer polyimide flex for dynamic and static applications.

Rigid-Flex

Hybrid constructions up to 20 layers — our specialty since day one.

RF / Microwave

Rogers, Taconic, low-loss laminates for high-frequency designs.

Metal Core / Heavy Copper

Aluminum-backed and copper-backed boards for thermal management.

One-stop solution

Everything for PCB & Assembly — under one roof.

Bare board fab through finished, tested hardware. Quote the whole program from one partner.

Rigid PCB, HDI and Anylayer (ELIC) Manufacturing

Flexible and Rigid-Flex Manufacturing

SMT & Through-Hole Assembly

Wave Solder for PCBA

One-Stop BOM Purchase Solution

Box Build Solutions Manufacturing

AOI, X-Ray, ICT & Functional Test

Conformal Coating, Potting & Packaging

Have a tough spec? Send it.

Our DFM engineers review every quote — including ITAR-controlled designs.

Request a Quote